Good Quality Polyamide Resin Curing Agent D-230  for Building Structure Adhesive

Product Details
Customization: Available
CAS No.: 25036-25-3
EINECS: 607-500-3
Still deciding? Get samples of US$ 200/500g
Request Sample
Manufacturer/Factory, Trading Company
Gold Member Since 2022

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Registered Capital
3000000 RMB
Plant Area
101~500 square meters
  • Good Quality Polyamide Resin Curing Agent D-230  for Building Structure Adhesive
  • Good Quality Polyamide Resin Curing Agent D-230  for Building Structure Adhesive
  • Good Quality Polyamide Resin Curing Agent D-230  for Building Structure Adhesive
  • Good Quality Polyamide Resin Curing Agent D-230  for Building Structure Adhesive
  • Good Quality Polyamide Resin Curing Agent D-230  for Building Structure Adhesive
  • Good Quality Polyamide Resin Curing Agent D-230  for Building Structure Adhesive
Find Similar Products
  • Overview
  • Product Description
  • Company Profile
Overview

Basic Info.

Model NO.
D230
Molecular Principal Chain
High-Molecular Polymer
Color
Yellowish Transparent
Application
Coating, Adhesive, Sealant, Epoxy Flooring
Appearance
Liquid
Equal to
D230
Amine Value
400-480
Basic
Polyamide Resin Hardener
Transport Package
Drum
Specification
195 KGS
Trademark
Honrel
Origin
China
HS Code
39073000
Production Capacity
90000tons Per Year

Product Description

Product Description

 

D-230 is characterized by repeating oxypropylene units in the backbone. It is a difunctional, primary amine with an average molecular weight of about 230.

1.  The physical and chemical properties

Color, Pt-Co
<30

Water, %
≤0.5

Amine value (mgKOH/g)
440~480

Primary Amine, %
≥97

Specific Gravity, 25 oC, g/cm3

0.948

Refractive Index, nD 20
1.4466

AHEW (Amine hydrogen equivalent wt.),g/eq
60

2.  Application
-Epoxy resin curing agent, adhesive (hard rubber) curing agent, curing agent for wind power blade
-Polyamide hot melt adhesive, electronic sealing glue curing agent
-electronic potting resin curing agent, curing agent for electronic packaging materials
-Fast curing RIM, building structure adhesive curing agent
-Polyether amine - modified curing agent, anticorrosive paint curing agent
-rod, golf clubs, tennis racket composite curing agent

3.  Storage and packaging
Stored in a cool and dry place with ventilation and can be sealed for 12 months. Package:195kg/ iron drum.

Our advantage:
We are very professional in manufacturing and exporting epoxy new materials for 20+ years, the capacity reaches 90000tons per year.
1. We can provide a full range of epoxy and polyamide systems not only resin and hardener but also diluents, accelerator, kinds of additives.
2. Our best-selling items are the countertype of Kukdo128/011X75/Dow125/Ancamine1618/AGE C12-14/BYK/ /Hexion/Huntsman and etc.
3. They are widely used in floor coatings, anti-corrosion coatings, solvent-free & waterborne coatings, construction, electrical sealants potting materials, adhesives, etc.
4. We have strong R&D powder, customized service and sample testing is available.
 
Company Profile

 

Good Quality Polyamide Resin Curing Agent D-230	for Building Structure AdhesiveGood Quality Polyamide Resin Curing Agent D-230	for Building Structure AdhesiveGood Quality Polyamide Resin Curing Agent D-230	for Building Structure AdhesiveGood Quality Polyamide Resin Curing Agent D-230	for Building Structure AdhesiveGood Quality Polyamide Resin Curing Agent D-230	for Building Structure AdhesiveGood Quality Polyamide Resin Curing Agent D-230	for Building Structure AdhesiveGood Quality Polyamide Resin Curing Agent D-230	for Building Structure AdhesiveGood Quality Polyamide Resin Curing Agent D-230	for Building Structure AdhesiveGood Quality Polyamide Resin Curing Agent D-230	for Building Structure Adhesive

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier