Customization: | Available |
---|---|
Bonding Function: | Structural Adhesive |
Morphology: | Solvent |
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HW-503 is a low molecular weight polyamide curing agent with high solids and low viscosity, which is formed by the condensation of multistage fatty amines and fatty acids, with good flow performance, fast curing speed, long pot life. It has good paint film after curing with epoxy resin,Good adhesion, excellent flexibility, excellent water and solvent resistance. Suitable for epoxy system coating Materials, industrial anti-corrosive primers, Marine paints, adhesives, sealants, electrical potting, coatings, flooring and high grade coatings.
Appearance | Light Yellowish transparent liquid |
Viscosity(CPS/25ºC) | 300-1200 |
Amine value (mgKOH/g) | 370-420 |
Color(Gardener) | ≤12 |
Solid content(%, 2g/3h/105°C) | ≥95 |
Density(g/cm³) | 0.95-1.00 |
A.H.E.W | 95-115 |
Adhesion strength(Kg/cm)
|
160 |
Tensile strength (Kg/cm)
|
600 |
Flexural strength (Kg/cm)
|
490 |
Compressive strength (Kg/cm)
|
580 |
Water resistance
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OK
|
Resistance to 5%H2SO4
|
Excellent
|
Resistance to 5%NaCl
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Excellent
|
Curing condition
|
25°C*7 days
|
Film thickness
|
200µ wet film
|
Preparation
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Method |
Epoxy resin 128
|
100 |
Hanamine 301
|
50 |
Pot life (250g, 25°C)
|
4hours
|
Film Gloss
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Excellent
|